Base materials for printed circuits - part 2 : specifications ; specification no . 13 : flexible copper - clad polyimide film , general purpose grade iec 60249 - 2 - 13 : 1987 a1 : 1993 ; german version en 60249 - 2 - 13 : 1994 a1 : 1994 印制电路板基材.第2部分:规范.第13号规范:软覆铜聚酰
Base materials for printed circuits - part 2 : specifications ; specification no . 15 : flexible copper - clad polyimide film , of defined flammability iec 60249 - 2 - 15 : 1987 a1 : 1993 ; german version en 60249 - 2 - 15 : 1994 a1 : 1994 印制电路用基材.第2部分:规范.第15号规范:规定易燃性
Pressure - sensitive adhesive tapes for electrical purposes - part 3 : specifications for individual materials ; sheet 7 : polyimide film tapes with pressure - sensitive adhesive iec 60454 - 3 - 7 : 1998 ; german version en 60454 - 3 - 7 : 1998 电工用热敏性粘胶带.第3部分:单项材料规范.第7页:压
. materials for interconnection structures - sectional specification set for unreinforced base materials , clad and unclad intended for flexible printed boards - adhesive coated flexible polyimide film - adhesive coated flexible polyimide film 互联结构材料.包被和非包被的非增强基材分规范集
. materials for printed boards and other interconnecting structures - part 3 - 4 : sectional specification set for unreinforced base materials , clad and unclad intended for flexible printed boards - adhesive coated flexible polyimide film 印制板和其它互连结构用材料.第3 - 4部分:包层和未包层非增强基底材料
. materials for printed boards and other interconnecting structures - part 3 - 4 : sectional specification set for unreinforced base materials , clad and unclad intented for flexible printed boards - adhesive coated flexible polyimide film 印刷板及其它互连结构用材料.第3 - 4部分:包覆和不包覆的非增强基材分规范集
Specification for plastic films for electrical purposes - part 3 : specifications for individual materials ; sheets 4 to 6 : requirements for polyimide films used for electrical insulation iec 60674 - 3 - 4 to 6 : 1993 ; german version en 60674 - 3 - 4 bis 6 : 1995 本标准除了那些能适用的并已在gb t 7341 . 1中作出规定的要求之外，对在频率范围从8000hz 16000hz作纯音测听使用而设计的测听设备的要求予以规定。
